Thermal Protection Coating Provides Protection in Harsh Environments.

SAN DIEGO, CA – May 5, 2008 – Space Micro's Advanced Materials Division announced today that it has developed of a high performance coating for thermal protection in extreme environments. This work is a derivative technology based upon the Temperature Sensitive Paint that was funded in part by an SBIR Phase II project with Arnold Engineering Development Center (AEDC), Arnold AFB, TN. This patent pending technology delivers a material that has demonstrated thermal resistance above 1400C in repeated thermal cycling and can be used to protect metals, ceramics, and some organic materials. Space Micro is seeking to finish commercial development of this technology with prime contractors or OEMS, including shipyards, aerospace and power generation facilities.

Carl S. Edwards, Advanced Materials Division Manager commented: “Originally developed for aerospace applications, our engineering team has developed this technology for the purpose of providing thermal protection for harsh environments and we are also looking at marine and terrestrial applications, including ship boilers and power stations.”

“Our approach to meeting this technical need was to develop a derivative product from the original platform technology developed for High Speed Wind Tunnels”, said David R. Czajkowski, CTO at Space Micro.

About Space Micro Inc.

Founded in 2002 as a satellite technology research and development company, Space Micro Inc. is a leader in taking technologies from the commercial sector and applying these to meet the needs of the Space, Aerospace, Military, and Domestic Security markets. Space Micro is a pioneer in providing radiation-hardened by design solutions for advanced electronic systems and microelectronics, including the development of the world"s fastest small space computers such as the Proton200kTM. Other Space Micro innovations include the Proton300K™; TTMR™; H-CORE™ and Radsite™. Space Micro is an employee-owned company based in San Diego, CA, USA.

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